Product Description
LCB3519AV200CoreModuleYesBased on HiSiliconHi3519AV200Chip PlatformA meticulously designed complete productFunctionCoreModule,Dimensionsonly50mm*50mm. CoreModuleWith the bottomBoardright of privacyConnectionAdopt180pinStamp hole, it leads outHi3403V100External pinsSignalAt the same time, it meets the requirements of high reliability, low cost, and high flexibility.
Technical Specifications